Production Capacity - CIRCUIT SOLUTIONS CO.,LTD

Rigid PCB Capacity
Flex and Rigid-flex PCB Capacity
Metal-core PCB Capacity
Manufacturing Lead Time

No	Item	Technical Data
1	Number of Layers	1-40 Layers
2	Max. Board Size	Single & double-sided: 600 * 1100mm Multilayer: 550 * 650mm
3	Board thickness	0.2-6.0mm
4	Min Line Width/Space	2mil/2mil(0.05/0.05mm)
5	Min. S/M Pitch	0.1mm(4mil)
6	Finish Drill Hole (Mechanical)	0.15mm--6.50mm
7	PTH Wall Thickness	>0.020mm(0.8mil)
8	Hole Dia. Tolerance (PTH)	±0.075mm(3mil)
9	Hole Dia. Tolerance (NPTH)	±0.05mm (2mil)
10	Hole Position Deviation	±0.05mm (2mil)
11	Outline Tolerance	±0.10mm (4mil)
12	Twist &Bow	≤0.7%
13	Insulation Resistance	>1012Ω Normal
14	Through hole resistance	<300Ω Normal
15	Electric strength	>1.3 kv/mm
16	Current breakdown	10A
17	Peel strength	1.4N/mm
18	S/M abrasion	>6H
19	Thermal stress	288℃ 20 Sec
20	Test Voltage	50-300V
21	Min. blind/buried via	0.2mm/0.2mm (Mechanical drill) 0.1mm(Laser drill blind via)
22	Available Laminates Material	CEM1, CEM3, FR-4, High-Tg FR4, Aluminum Base, Rogers, Taconic, Arlon etc.
23	Finished board thickness tolerance	T>=0.8mm,Tolerance:+/-8%,T<0.8mm :+/-10%
24	Out Layer Copper Thickness	1oz--6oz
25	Inner Layer Copper Thickness	1/2oz--4oz
26	Aspect Ratio	15:1
27	Min. Solder Mask Bridge	0.08mm
28	Mini. Solder Mask Clearance	0.05mm
29	Plug Hole Diameter	0.2mm--0.50mm
30	Impedance Control Tolerance	+/-5% & +/-10%
31	Surface Finish	HASL, HAL（Lead free）, Immersion Gold/Tin/Silver, Gold Plated, OSP, Gold Finger, Peelable mask
32	Insulation Layer Thickness	0.075mm--5.00mm
33	Special technology	Thick hard gold plating, Via in Pad, Counterbore& Countersunk etc.

No	Item	Capacity
1	Layer Count	Flex Board 1-6 Layer Rigid-flex Board: 2-8 Layer
2	Material	PI, PET, PEN, FR-4
3	Maximum Size	250mm*1200mm
4	Board Outline Tolerance	±0.1mm
5	Board Thickness	0.10mm--0.4mm
6	Thickness Tolerance( t≥0.8mm)	±10%
7	Minimum Line	0.05mm(2mil)
8	Minimum Space	0.05mm(2mil)
9	Out Layer Copper Thickness	12um--70um
10	Inner Layer Copper Thickness	12um--35um
11	M in Drilling Hole (Mechanical)	0.15mm
12	Diameter Tolerance (Mechanical)	0.075mm
13	Registration (Mechanical)	0.075mm
14	Solder Mask Type	Coverlay
15	Surface Finish	ENIG Gold, Gold Plated, OSP, Immersion Tin, Immersion Silver
16	Gold Plating	Nickel: 100u" - 200u" Gold: 1u"-4u"
17	Immersion Nickel / Gold	Nickel: 100u" - 200u" Gold: 1u"-5u"
18	Immersion Silver	Silver: 6u" - 12u"
19	OSP	Film: 8u" - 20u"
20	Test Voltage	Testing Fixture: 50-300V

No	Item	Technical Data
1	Layer Count	1-2 Layers
2	Materials	Aluminum / Copper base
3	Finished Thickness	0.5-3.0mm
4	Max Board Size	1200mm x 600mm
5	Insulating Layer Thickness	50, 75, 100, 125, 150micron
6	Min trace Width/Spacing	6mil/6mil(0.15/0.15mm)
7	Copper Thickness	0.5oz-3oz
8	Min hole size	0.6mm
9	Thermal Conductivity	1.0-4.0W/m.K
10	Aluminum Type	3003, 5052, 6061 etc.
11	Breakdown voltage	2-8KV
12	Min Solder Dam	4mil
13	Min Hole Ring	4mil
14	Twist& Bow	≤0.7%
15	Test Voltage	50-300V
16	Solder Mask Color	White, Black, Red, Green, Blue, Yellow
17	Silkscreen color	White, Black
18	Tolerance of Profile	+/-5mil
19	Peel Strength	≥1.8N/MM
20	Surface Resistance	≥ 1*105 M
21	Dielectric Constant	≤ 4.4 ≤ 0.03
22	Surface Treatment	HAL (Lead-free), Immersion gold/Tin, OSP, Gold plating

As your reliable and engaging partner in PCB fabrication, assembly and full turkey solutions, we understand fully that how quick and precision lead-time means much in changing markets. To ensure our customers have plenty time for the whole project in advance, we provide 24 hours PCB prototyping quick turns with high quality.

Our general manufacturing lead-time for prototyping, fastest and standard small to middle volume production are as bellows.

layer	Quickest lead Time	Standard Lead Time
2	24 Hours	4 WD
4	48 Hours	5 WD
6	3 WD	6 WD
8	3 WD	7 WD
10	3 WD	8 WD
12	4 WD	8 WD
14	4 WD	9 WD
≥16	Up to Gerber files	Up to Gerber files

navigation

Contact Us

message

navigation

Contact Us