-
HDI 3+N+3 Stack-up PCBLayer count: 6 Layer
Board thickness: 1.4mm
Material: FR4
Min. Hole diametre: 0.4mm
Surface Treatment: ENIG
-
HDI 3+N+3 Stack-up PCB/ Medical device PCBLayer count: 3+6+3 Layer
Board thickness: 1.6mm
Material: FR4
Min. Hole diametre: 0.4mm
Surface Treatment: ENIG
-
HDI 3+N+3 Stack-up PCBLayer count: 3+4+3 Layer
Board thickness: 1.6mm
Material: FR4
Min. hole diametre: 0.4mm
Surface Treatment: ENIG
-
Layer Count: 16 LayersType of stack up: 3+10+3
Material Available: FR4
Board thickness: 1.0mm
Surface Treatment: ENIG 1u"
-
Layer Count: 10 LayersType of stack up: 3+4+3
Material Available: FR4
Board thickness: 1.6mm
Surface Treatment: ENIG
-
Layer Count: 4LayersType of stack up: 1+2+1
Material Available: High Tg FR4
Board thickness: 1.2mm
Finished copper thickness: 1oz
Min. trace width/spacing: 3/3mil
Min. through hole: 0.2mm
Surface treatment: ENIG
-
Taconic High Frequency PCB
Layer count:2 Layer
Board thickness：0.8mm
Size：137.16mm*89.92mm
Material：RF-35
Min. Hole Diameter：0.25mm
Surface Treatment：ENIG
-
Arlon High Frequency Mixed PCB
Layer count:2Layer
Board thickness：1.0mm
Size：42.1mm*48.6mm
Material：FR4
Min. Hole Diameter：0.5mm
Surface Treatment：Gold Plating
-
High Frequency Mixed PCB
Layer count:2 Layer
Board thickness：0.8mm
Size：52.1mm*48.6mm
Material：FR4
Min. Hole Diameter：0.6mm
Surface Treatment：Gold Plating
-
Rogers High Frequency PCB/ RF Microwave PCB
Layer count:2Layer
Board thickness：0.8mm
Size：42.1mm*38.6mm
Material：Rogers
Min. Hole Diameter：0.8mm
Surface Treatment：ENIG
-
GPS PCB/ High Frequency Mixed PCB
Layer count:4 Layer
Board thickness：1.4mm
Size：76mm*63mm
Material：High Frequency PCB
Min. Hole Diameter：0.8mm
Surface Treatment：ENIG
-
Power Divider PCB
Layer count:2 Layer
Board thickness：1.0mm
Size：76mm*53mm
Material：F4BM
Min. Hole Diameter：0.8mm
Surface Treatment：ENIG
-
High Frequency Mixed PCB
Layer count: 6 Layer
Board thickness：1+/-0.1mm
Size：108.82mm*91.56mm
Material：Rogers 1350B
Min. Hole Diameter：0.25mm
Surface Treatment：ENIG
-
2.4G Radar RF Microwave PCB
Layer count:2 Layer
Board thickness：1.0mm
Size：22.16mm*32.4mm
Material：FR4 High Frequency PCB
Min. Hole Diameter：0.4mm
Surface Treatment：ENIG
-
High Frequency Mixed PCB for Industrial Control Products
Layer count: 4Layer
Board thickness：1.6+/-0.1mm
Size：88.12mm*60.56mm
Material：FR4
Min. Hole Diameter：0.5mm
Surface Treatment：ENIG
-
High Frequency Mixed PCB
Layer count: 2 Layer
Board thickness：1.4+/-0.1mm
Size：108.82mm*88.56mm
Material：FR4
Min. Hole Diameter：0.3mm
Surface Treatment：Gold Plating
-
RF Microwave PCB for Remote Control
Layer count: 4 Layer
Board thickness：1.2+/-0.1mm
Size：70.82mm*40.56mm
Material：FR4
Min. Hole Diameter：0.5mm
Surface Treatment：Gold Plating
-
Arlon High Frequency Mixed PCB
Layer count: 6Layer
Board thickness：1.6+/-0.1mm
Size：108.82mm*50.56mm
Material：FR4
Min. Hole Diameter：0.4mm
Surface Treatment：ENIG
-
RO4350B High Frequency Mixed PCB
Layer count:6Layer
Board thickness：1.4mm
Size：122.16mm*80.92mm
Material：FR4, Rogers RO4350B
Min. Hole Diameter：0.4mm
Surface Treatment：ENIG
-
High Frequency Mixed PCB
Layer count:4Layer
Board thickness：1.4mm
Size：112.1mm*80.9mm
Material：FR4, Rogers
Min. Hole Diameter：0.4mm
Surface Treatment：ENIG
