Turnkey PCB Assembly and Fabrication - Circuit Solutions

sales@btlpcb.com | +86 755 2357 9972
Circuit Solutions provides one-stop turnkey solutions, including PCB Fabrication, Components Procurement, and PCB Assembly services. With our longtime stable suppliers of components, we are flexible to sourcing the most cost-effective and genuine components for our customers, which ensure reliable performance of your final products. Moreover, we are now developing our own components store recently.
For PCB Assembly prototyping and production, we have 7 surface mount lines, for solder paste printing, selective glue dispense, component placement, and reflow technologies through BGA. We also have 3 manual assembly lines, with lead-free wave soldering equipment.
 
PCB Assembly Services: Manual Assembly, Pick & Place Assembly, Through Hole Assembly, Surface Mount Assembly (SMT), BGA Assembly + X-Ray.
 
Numerous tests shall be applied before delivery of PCBA.
Visual Inspection: general quality checks.
X-ray Inspection: BGA, QFN, and bare circuit boards.
AOI Testing: solder paste, 0201 components, missing components and polarity.
ICT (In-Circuit Test)
Functional Test (following to customers’ test procedures)
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
  • Process: SMT+DIP
    Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
    Min Parts: 0201
    Min BGA Pitch: 0.5mm
    Min IC Pitch: 0.4mm
    X-ray and ICT test
Expand