Rigid-flex PCB is a integrated solution of flexible and rigid PCB board, with advantages of both, into a single board. With its bending and flexible form, it develops rapidly in industries like:
• Communication
• Industrial and Automotive Control
• Aerospace and Military
• Medical
• Communications
• Transportation
• Consumer-electronics
Seizing the development of Rigid PCB and Rigid-flex PCB, we have introduced a new flex and rigid-flex department for years, now with the capacity of 1-6 Layer Flex PCB and 2-10 Layer Rigid-flex PCB. Our experts are always here to offer help in every single process from design to production.
General Specification of Flex PCB and Rigid-flex PCB in Circuit Solutions:
Layer count: 1-6L (Flex), 2-10L (Rigid-flex)
Board Thickness: 0.05-0.3mm
Base polyimide film thickness: 0.5mil (12.5µ), 1mil (25µ), 2mil (50µ)
Copper thickness: 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
Stiffeners: Polyimide, FR4, Metal
Min trace width/spacing: 3/3mil(0.075/0.075mm)
Min drill size: 0.2mm
Surface treatment: Immersion Gold/Tin, Gold/Tin Plating, OSP
• Communication
• Industrial and Automotive Control
• Aerospace and Military
• Medical
• Communications
• Transportation
• Consumer-electronics
Seizing the development of Rigid PCB and Rigid-flex PCB, we have introduced a new flex and rigid-flex department for years, now with the capacity of 1-6 Layer Flex PCB and 2-10 Layer Rigid-flex PCB. Our experts are always here to offer help in every single process from design to production.
General Specification of Flex PCB and Rigid-flex PCB in Circuit Solutions:
Layer count: 1-6L (Flex), 2-10L (Rigid-flex)
Board Thickness: 0.05-0.3mm
Base polyimide film thickness: 0.5mil (12.5µ), 1mil (25µ), 2mil (50µ)
Copper thickness: 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
Stiffeners: Polyimide, FR4, Metal
Min trace width/spacing: 3/3mil(0.075/0.075mm)
Min drill size: 0.2mm
Surface treatment: Immersion Gold/Tin, Gold/Tin Plating, OSP
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Rigid-flex PCB
Layer count: 4 Layer
Board thickness: 1.2mm
Size: 102.82mm*58.56mm
Material: FR4
Min. Hole Diameter: 0.3mm
Surface Treatment: ENIG
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Layer count: 4 LayerBoard Thickness: 0.2mmBase polyimide film thickness: 1mil (25?Copper thickness: 1oz (35?Stiffeners: FR4Min trace width/spacing: 3/3mil(0.075/0.075mm)Min drill size: 0.2mmSurface treatment: ENIG
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Layer count: 6 LayerBoard Thickness: 0.2mmBase polyimide film thickness: 2mil (50?Copper thickness: 1oz (35?Stiffeners: FR4Min trace width/spacing: 3/3mil(0.075/0.075mm)Min drill size: 0.2mmSurface treatment: ENIG