Since the SMT chip processing profession has been carried out so far, common terms in some professions have also been widely circulated. As a beginner, it is necessary to understand the special terminology of the electronic processing profession. The following hundred thousand technicians will pack up some commonly used terms for SMT patch processing for us.

1. assuming solder joints:

(1) The surface of the solder joint has outstanding moisture, that is, the molten solder should spread on the surface of the metal to be welded and constitute a continuous, uniform, and intact solder cover layer. The touch angle should be less than or equal to 90°;

(2) Apply the correct amount of solder, the amount of solder should be satisfied;

(3) With outstanding welding appearance, the appearance of the solder joint should be continuous, intact and smooth, but it does not require a very bright appearance;

(4) Good solder joint orientation. The azimuth error of the pin or solder tail of the component on the pad should be within the scale of the rule.
 

2. Not wet: The contact angle between the surface of the soldered metal and the solder on the solder joint is greater than 90°.
 

3. open welding: After welding, PCB board and pad surface separation.

4. Suspension bridge: One end of the component leaves the pad and is in an inclined or upright position.
 

5. Bridge: Solder between two or more solder joints that should not be connected, or solder joints of solder joints with adjacent conductors.
 

6. Weld-weld: After welding, there is sometimes a phenomenon of resistance separation between the soldering end or the lead and the pad.
 

7. Tip: The solder has burrs in the solder joints, but does not touch other solder joints or conductors.
 

8. Solder balls: Solder balls that adhere to conductors, solder pads, or printed boards during soldering.

9. Holes: The welding area presents different sizes of air.
 

10. Azimuth deviation: When the welding spot is in the plane, longitudinal direction, rotation direction or horizontal direction, it violates the reserved orientation.
 

11, visual inspection method: With low-magnification lighting with a magnifying glass, with the naked eye to check the quality of PCBA solder joints.
 

12. Post-weld inspection: Inspection of quality after PCBA welding is completed.
 

13. Rework:
The process of removing some of the disadvantages of the assembly of the external assembly.

14, patch inspection: surface mount component placement or after completion, on whether missing, dislocation, paste wrong, damage ratio and the quality of the case carried out.
 

The commonly used terminology of SMT chip processing, introduced into the first hundred thousand, and hope can help you.